Title :
Flexible polysiloxane Interconnection Between Two Substrates For Microsystem Assembly
Author :
Arquint, Philippe ; Van der Wal, Peter D. ; Van der Schoot, Bart H. ; De Rooij, Nico F.
Author_Institution :
Universit of Neuchatel
Keywords :
Adhesives; Assembly systems; Bonding; Curing; Humidity; Lithography; Polymer films; Silicon; Substrates; Surface treatment;
Conference_Titel :
Solid-State Sensors and Actuators, 1995 and Eurosensors IX.. Transducers '95. The 8th International Conference on
Print_ISBN :
91-630-3473-5
DOI :
10.1109/SENSOR.1995.717164
