• DocumentCode
    3292098
  • Title

    Modeling on a non-contact power transmission system in ultrasonic machining

  • Author

    Zhili Long ; Xiangwei Lin ; Wen Yuan ; Jianguo Zhang

  • Author_Institution
    Shenzhen Grad. Sch., Harbin Inst. of Technol., Shenzhen, China
  • fYear
    2013
  • fDate
    12-14 Dec. 2013
  • Firstpage
    1042
  • Lastpage
    1047
  • Abstract
    To optimize the traditional energy transmission where the slip ring abrades quickly and the spindle speed is not high enough in the rotary ultrasonic machining, the research is conducted on the non-contact power transmission system. Based on the principle of electromagnetic induction and Maxwell platform, the theoretical and the related simulation models of the mutual inductance of the non-contact power transmission system are established. A rotary electromagnetic coupling mechanism is then set up to verify those models. Through the simulation modeling and experiment verifying, the influencing factors on the transfer efficiency, such as the rotation speed, inter-stage magnetic gap, the ultrasonic frequency and resonance matching parameters have been investigated. As a result, the transfer efficiency at a high rotary speed can reach 80%, which provided a reference for the optimal design of the ultrasonic spindle.
  • Keywords
    Maxwell equations; electromagnetic induction; machine tool spindles; power transmission (mechanical); ultrasonic machining; Maxwell platform; electromagnetic induction; energy transmission; interstage magnetic gap; mutual inductance; noncontact power transmission system; optimal design; resonance matching parameter; rotary ultrasonic machining; rotation speed; slip ring; spindle speed; ultrasonic frequency; ultrasonic spindle; Acoustics; Air gaps; Coils; Inductance; Integrated circuit modeling; Magnetic cores; Resonant frequency; Load Matching; Maxwell Simulation; Resonance Compensation; inductively coupled power transfer (ICPT); ultrasonic machining;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Robotics and Biomimetics (ROBIO), 2013 IEEE International Conference on
  • Conference_Location
    Shenzhen
  • Type

    conf

  • DOI
    10.1109/ROBIO.2013.6739601
  • Filename
    6739601