DocumentCode :
3292101
Title :
The elastic properties of PECVD silicon oxynitride films on gallium arsenide
Author :
Hickernell, T.S. ; Hickernell, F.S.
Author_Institution :
Motorola Inc., Scottsdale, AZ, USA
fYear :
1991
fDate :
8-11 Dec 1991
Firstpage :
51
Abstract :
The elastic constants of low-stress plasma-enhanced chemical vapor deposition (PECVD) grown silicon oxynitride on GaAs are calculated from surface acoustic wave (SAW) measurements. Films from 1000 to 4000 nm in thickness are shown to have very consistent densities and SAW velocity dispersion characteristics. The density of the films is below that of bulk fused quartz, but the elastic moduli are similar to those of fused quartz. The low density indicates that low-temperature PECVD silicon oxynitride is inherently porous compared to an equivalent bulk material
Keywords :
acoustic wave velocity; elastic constants; insulating thin films; plasma CVD coatings; silicon compounds; surface acoustic waves; 1000 to 4000 nm; PECVD; SiOxN7-GaAs; elastic constants; elastic properties; low-stress plasma-enhanced chemical vapor deposition; surface acoustic wave; velocity dispersion; Chemical vapor deposition; Gallium arsenide; Plasma chemistry; Plasma density; Plasma measurements; Plasma properties; Plasma waves; Semiconductor films; Silicon; Surface acoustic waves;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 1991. Proceedings., IEEE 1991
Conference_Location :
Orlando, FL
Type :
conf
DOI :
10.1109/ULTSYM.1991.234126
Filename :
234126
Link To Document :
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