DocumentCode :
329247
Title :
Silicon Fusion Bonding and Deep Reactive Ion Etching a New Technology for Microstructures
Author :
Klaassen, Erno H. ; Petersen, Kurt ; Noworolski, J.M. ; Logan, John ; Maluf, Nadim I. ; Brown, Joe ; Storment, Christopher ; McCullcy, W. ; Kovacs, Gregory T A
Author_Institution :
Stanford University
Volume :
1
fYear :
1995
fDate :
25-29 Jun 1995
Firstpage :
556
Lastpage :
559
Keywords :
Anisotropic magnetoresistance; Bonding; Etching; Micromachining; Micromechanical devices; Microstructure; Resists; Silicon; Substrates; Surface impedance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors and Actuators, 1995 and Eurosensors IX.. Transducers '95. The 8th International Conference on
Print_ISBN :
91-630-3473-5
Type :
conf
DOI :
10.1109/SENSOR.1995.717285
Filename :
717285
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=329247
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