Title :
A Novel Etch-diffusion Process For Fabricating High Aspect Ratio Si Microstructures
Author :
Juan, W.H. ; Pang, S.W.
Author_Institution :
The University of Michigan
Keywords :
Diffusion processes; Dry etching; Microsensors; Microstructure; Plasma applications; Plasma sources; Polymers; Resonance; Wafer bonding; Wet etching;
Conference_Titel :
Solid-State Sensors and Actuators, 1995 and Eurosensors IX.. Transducers '95. The 8th International Conference on
Print_ISBN :
91-630-3473-5
DOI :
10.1109/SENSOR.1995.717286
