Title :
Packaging in the IT environment: competing challenges in the design of packaging for electronic products
Author :
Horbal, John ; Schaffer, Mark
Author_Institution :
World Wide Packaging, Shock & Vibe, Dell Inc., USA
Abstract :
Provide an overview of packaging design considerations through modeling and testing to optimize packaging for electronic products and to provide details of the packaging challenge from an environmental perspective.
Keywords :
electronic products; electronics packaging; environmental factors; IT environment; electronic products packaging; packaging design; Accelerometers; Design optimization; Electric shock; Electronic equipment testing; Electronics packaging; Frequency; Gravity; Protection; Raw materials; Shape;
Conference_Titel :
Electronics and the Environment, 2005. Proceedings of the 2005 IEEE International Symposium on
Print_ISBN :
0-7803-8910-7
DOI :
10.1109/ISEE.2005.1437000
