• DocumentCode
    3292730
  • Title

    Effect of Au buffer on the field emission characteristics of chemical vapor deposited diamond films

  • Author

    Lee, J.S. ; Liu, K.S. ; Chuang, F.Y. ; Sun, C.Y. ; Huang, C.M. ; Lin, I.N.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • fYear
    1996
  • fDate
    7-12 Jul 1996
  • Firstpage
    235
  • Lastpage
    239
  • Abstract
    Au-precoating on silicon substrate was observed to enhance the field emission characteristics of diamond films deposited by chemical vapor deposition technique. The emission current density increased substantially from 1 μA/cm2 to 100 μA/cm2, while the turn on voltage decreased moderately from 14 MV/m to 10 MV/m. Raman spectra and electron diffraction in transmission electron microscopy (TEM) revealed that both diamond films deposited on Si or Au-coated Si (Au/Si) were nanosized crystals. The Au species were assumed to diffuse along grain boundaries, resulting in low resistance diamond films. Abundant supply of electrons via conducting grain boundaries was presumably the mechanism that enhanced the field emission of the diamond films grown on Au/Si substrates
  • Keywords
    CVD coatings; Raman spectra; diamond; electron diffraction; electron field emission; gold; grain boundary diffusion; nanostructured materials; transmission electron microscopy; Au-Si; C; Raman spectra; buffer; chemical vapor deposition; current density; diamond film; electron diffraction; field emission; gold precoating; grain boundary diffusion; nanosized crystals; resistance; silicon substrate; transmission electron microscopy; turn on voltage; Chemical vapor deposition; Current density; Diffraction; Electron emission; Gold; Grain boundaries; Semiconductor films; Silicon; Transmission electron microscopy; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Microelectronics Conference, 1996. IVMC'96., 9th International
  • Conference_Location
    St. Petersburg
  • Print_ISBN
    0-7803-3594-5
  • Type

    conf

  • DOI
    10.1109/IVMC.1996.601815
  • Filename
    601815