Title :
Self-aligned SOI MOSFETs with Ω-shaped conductive layer and source/drain-tie
Author :
Lin, Jyi-Tsong ; Chang, Tzu-Feng ; Eng, Yi-Chuen ; Chen, Hsuan-Hsu ; Kuo, Chih-Hao ; Sun, Chih-Hung ; Lin, Po-Hiesh ; Chiu, Hsien-Nan
Author_Institution :
Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Abstract :
In this paper, we propose a novel self-aligned silicon-on-insulator (SOI) MOSFET with Omega-shaped conductive layer and source/drain-tie (SA-OmegaCFET). Based on the TCAD 2D simulation results, we find that combining the applications of a nature Source/Drain (S/D) tie with a recessed S/D region can effectively improve the issue of self-heating effects, but without losing control of the short-channel effects. Moreover, owing to the presence of the thick S/D junction thickness the parasitic S/D series resistance is reduced thus our proposed structure can gain a higher drain on-current and a higher maximum transconductance as compared with the conventional UTSOI device.
Keywords :
MOSFET; silicon-on-insulator; technology CAD (electronics); Omega-shaped conductive layer; S/D junction thickness; TCAD 2D simulation; UTSOI device; parasitic S/D series resistance; self-aligned SOI MOSFET; self-aligned silicon-on-insulator MOSFET; self-heating effects; short-channel effects; source/drain-tie; transconductance; CMOS technology; Degradation; Lattices; Leakage current; MOSFETs; Silicon on insulator technology; Sun; Temperature; Thermal stability; Transconductance;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2009.5232558