Title :
Unusual defects, generated by wafer sawing: Diagnosis, mechanisms and how to distinguish from related failures
Author :
Jacob, Peter ; Rothkirch, Werner
Author_Institution :
Dept. 173, Empa, Dubendorf, Switzerland
Abstract :
In the wafer sawing process, unusual failures were observed and their root causes have been investigated. Besides classical and well-known failures, the following failure mechanisms were found: surface-ESD (ESDFOS), caused by charged water drops and friction electricity of blue carrier foils, ultrasonic cleaning-induced splittering of small surface structures and EEPROM memory loss. Some examples allow valuable conclusions for failure analysis and perform hints how to reduce or eliminate the problem by tool modifications.
Keywords :
EPROM; assembling; electrostatic discharge; reliability; sawing; EEPROM memory loss; blue carrier foils; charged water drops; friction electricity; surface structures; surface-ESD; tool modifications; ultrasonic cleaning-induced splittering; wafer sawing; Assembly; Dielectrics; EPROM; Electrostatics; Failure analysis; Jacobian matrices; Passivation; Sawing; Voltage; Wheels;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2009.5232563
