DocumentCode
3293091
Title
Current topics on PV module and system reliability
Author
Ji, Liang
Author_Institution
Underwriters Labs. Inc. (UL), Northbrook, IL, USA
fYear
2009
fDate
6-10 July 2009
Firstpage
640
Lastpage
640
Abstract
This presentation gives a brief introduction for current topics discussed in photovoltaics (PV) industry, especially by the international standard, testing and certification community. So far, the widely used standards are either deal with a design qualification and type approval (such as IEC 61215, IEC 61646), or module safety (such as IEC 61730, UL 1703). Some people in the PV community considered, or declared, that if the product passed these test, they are guaranteed for 20 years or more operation. These opinions are considered by many experts as not correct. For example, on IEC 61215, it specified that ldquoThe object of this test sequence is to determine the electrical and thermal characteristics of the module and to show, as far as is possible within reasonable constraints of cost and time, that the module is capable of withstanding prolonged exposure in climates described in the scope. The actual lifetime expectancy of modules so qualified will depend on their design, their environment and the conditions under which they are operated. "The presentation includes newly founded failures occurred on the real PV installations, their possible failure roots, suggested corrections, modifications on standard requirements and testing methods. In specific, the hot-spot endurance test, salt mist test, long term polymer material test, and UV exposal test will be discussed in details.
Keywords
photovoltaic power systems; power system reliability; UV exposal test; hot-spot endurance test; international standard; long term polymer material test; photovoltaic installations; photovoltaic module; photovoltaic system reliability; salt mist test; test sequence; Certification; IEC standards; Laboratories; Materials testing; Photovoltaic cells; Qualifications; Reliability; Safety; System testing; USA Councils;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location
Suzhou, Jiangsu
ISSN
1946-1542
Print_ISBN
978-1-4244-3911-9
Electronic_ISBN
1946-1542
Type
conf
DOI
10.1109/IPFA.2009.5232564
Filename
5232564
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