New solutions for reusing nonmetals reclaimed from waste printed circuit boards

Author

Peng, Mou ; Dong, Xiang ; Xiaoyong, Pan ; Layiding, Wa ; Jiangang, Gao ; Guanghong, Duan

Author_Institution

Dept. of Precision Instrum. & Mechanology, Tsinghua Univ., Beijing, China

fYear

2005

fDate

16-19 May 2005

Firstpage

205

Lastpage

209

Abstract

In waste printed circuit boards (PCBs) recycling fields, how to recycle and reuse nonmetals is a challenging problem, and there is no preferable solutions up to now. This paper presents new methods for reusing nonmetals reclaimed from waste PCBs. Nonmetals are used to make formative models, compound boards or related products. When compared with traditional materials, such as talc and silica powder, PCB nonmetals improve the mechanical features of these products greatly with comparable tensile and shearing strength and 30 percent larger flexural strength, which indicates good application prospect for its undoubted potential.

Keywords

bending strength; polymers; printed circuits; waste management; compound boards; flexural strength; mechanical feature; recycling; waste printed circuit boards nonmetals reuse; Building materials; Epoxy resins; Glass; Inorganic materials; Instruments; Powders; Printed circuits; Recycling; Research and development; Silicon compounds;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics and the Environment, 2005. Proceedings of the 2005 IEEE International Symposium on

ISSN

1095-2020

Print_ISBN

0-7803-8910-7

Type

conf

DOI

10.1109/ISEE.2005.1437026

Filename

1437026