DocumentCode
3293163
Title
Analysis and Risk Communication of 20 Years of Exposure Monitoring of Photolithography Solvents from all Intel Fabs
Author
Hunsaker, Harry
Author_Institution
Intel Corp., Rio Rancho
fYear
2006
fDate
25-27 Sept. 2006
Firstpage
35
Lastpage
38
Abstract
Twenty years of air sampling of 16 volatile solvents in photolithography from Intel fabs were analyzed. The 95% upper confidence limit of the 95th percentile of the samples were one-half or less than the full-shift occupational exposure limits. Each air sample was converted to a single, 15-minute exposure for comparison to the short-term exposure limits (STEL). The calculation indicated it was unlikely that the STEL values were exceeded. Inhalation exposures to the solvents have been acceptably low and well controlled for full-shift and for short-term exposure durations over many generations of processes, process equipment, and job duties.
Keywords
integrated circuit manufacture; monitoring; occupational health; photolithography; risk analysis; solvents (industrial); Intel Fabs; air sampling; exposure monitoring; full-shift occupational exposure limits; inhalation exposures; photolithography solvents; risk communication; short-term exposure limits; time 15 min; Chemical industry; Employment; Lithography; Monitoring; Protection; Resists; Risk analysis; Risk management; Sampling methods; Solvents;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
Conference_Location
Tokyo
ISSN
1523-553X
Print_ISBN
978-4-9904138-0-4
Type
conf
DOI
10.1109/ISSM.2006.4493016
Filename
4493016
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