• DocumentCode
    3293163
  • Title

    Analysis and Risk Communication of 20 Years of Exposure Monitoring of Photolithography Solvents from all Intel Fabs

  • Author

    Hunsaker, Harry

  • Author_Institution
    Intel Corp., Rio Rancho
  • fYear
    2006
  • fDate
    25-27 Sept. 2006
  • Firstpage
    35
  • Lastpage
    38
  • Abstract
    Twenty years of air sampling of 16 volatile solvents in photolithography from Intel fabs were analyzed. The 95% upper confidence limit of the 95th percentile of the samples were one-half or less than the full-shift occupational exposure limits. Each air sample was converted to a single, 15-minute exposure for comparison to the short-term exposure limits (STEL). The calculation indicated it was unlikely that the STEL values were exceeded. Inhalation exposures to the solvents have been acceptably low and well controlled for full-shift and for short-term exposure durations over many generations of processes, process equipment, and job duties.
  • Keywords
    integrated circuit manufacture; monitoring; occupational health; photolithography; risk analysis; solvents (industrial); Intel Fabs; air sampling; exposure monitoring; full-shift occupational exposure limits; inhalation exposures; photolithography solvents; risk communication; short-term exposure limits; time 15 min; Chemical industry; Employment; Lithography; Monitoring; Protection; Resists; Risk analysis; Risk management; Sampling methods; Solvents;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
  • Conference_Location
    Tokyo
  • ISSN
    1523-553X
  • Print_ISBN
    978-4-9904138-0-4
  • Type

    conf

  • DOI
    10.1109/ISSM.2006.4493016
  • Filename
    4493016