• DocumentCode
    3293299
  • Title

    Cycle Time Reduction Through Preventive Maintenance De-clustering

  • Author

    Zhang, Mike Tao ; Tag, Peter H.

  • Author_Institution
    Intel Corp., Santa Clara
  • fYear
    2006
  • fDate
    25-27 Sept. 2006
  • Firstpage
    70
  • Lastpage
    73
  • Abstract
    Cycle-time (CT) is one of the key performance metrics for silicon wafer fabrication factories (fabs). The largest component of CT is the time lots spend in queue waiting for processing. A primary cause of queue-time is the variability of toolset availability (VA). One component of VA occurs when usage-based preventative maintenance (PM) events are clustered in time, i.e., unevenly spaced. This portion of VA may be significantly reduced by intelligent PM scheduling to de-cluster PMs. In this paper, we present a case study on how eManufacturing is applied to enable PM spacing. The PM schedules are generated by a MILP-based (mixed-integer linear programming) optimizer. The fab automation systems visually display the solver results to technicians. An advanced simulator-optimizer system has been developed to test this eManufacturing approach. It demonstrated ~20% reduction in VA and ~30% reduction in CT for a thin film toolset.
  • Keywords
    integer programming; integrated circuit manufacture; linear programming; materials handling; preventive maintenance; production engineering computing; automated material handling systems; cycle time reduction; eManufacturing; mixed-integer linear programming optimizer; preventive maintenance declustering; queue-time; semiconductor manufacturing; silicon wafer fabrication factories; toolset availability; Automation; Availability; Displays; Fabrication; Linear programming; Measurement; Preventive maintenance; Production facilities; Silicon; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
  • Conference_Location
    Tokyo
  • ISSN
    1523-553X
  • Print_ISBN
    978-4-9904138-0-4
  • Type

    conf

  • DOI
    10.1109/ISSM.2006.4493025
  • Filename
    4493025