• DocumentCode
    3293326
  • Title

    Property of polyaniline /multi-wall carbon nanotube composites

  • Author

    Ju, Changbin ; Wang, Yongsheng ; He, Dawei ; Fu, Ming ; Du, Yufan ; Feng, Bin ; Jiang, Jinghua

  • Author_Institution
    Key Lab. of Luminescence & Opt. Inf., Beijing Jiaotong Univ., Beijing, China
  • fYear
    2009
  • fDate
    6-10 July 2009
  • Firstpage
    585
  • Lastpage
    588
  • Abstract
    Composites of polyaniline (PANI) and multi-wall carbon nanotubes (MWNT) were synthesized by in-situ polymerization at different multi-wall carbon nanotube contents. The composites were characterized by Fourier transform infrared (FT-IR) spectroscopy, scanning electron microscopy (SEM) and X-ray podwer diffraction (XRD). The results show that a mass of MWNT was enchased into PANI matrix and a bit of MWNT´s surface was covered with PANI. There are no covalent interactions between PANI and MWNT. The composites´ conductibility was measured by four-point electric conductivity measurement on pellets compressed at 20MPa. It can be confirmed that the composites of carbon nanotubes have a higher conductivity compared to pure PANI. The composites did not have a lower infrared emissivity than pure PANI and the magnitude of infrared emissivity was not influenced by the content of MWNT within the percentage range of MWNT studied.
  • Keywords
    Fourier transform spectra; X-ray diffraction; carbon nanotubes; conducting polymers; electrical conductivity; emissivity; infrared spectra; nanocomposites; polymerisation; scanning electron microscopy; FTIR spectroscopy; Fourier transform infrared spectroscopy; X-ray powder diffraction; four-point electric conductivity measurement; in-situ polymerization; infrared emissivity; polyaniline/multi-wall carbon nanotube composites; scanning electron microscopy; Carbon nanotubes; Conductivity measurement; Electric variables measurement; Fourier transforms; Infrared spectra; Polymers; Scanning electron microscopy; Spectroscopy; X-ray diffraction; X-ray scattering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
  • Conference_Location
    Suzhou, Jiangsu
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4244-3911-9
  • Electronic_ISBN
    1946-1542
  • Type

    conf

  • DOI
    10.1109/IPFA.2009.5232577
  • Filename
    5232577