Title :
Troubleshooting Tracks with Vibration Detection and Storage Technology
Author :
Wahner, Lester J.
Author_Institution :
Intel Corp., Rio Rancho
Abstract :
Scrapped wafers and excursions caused by wafer handling has been an on going concern. Serious tool problems that don´t get adequately addressed in typical PM protocols are part of the issue. Capturing wafer handling issues before they become excursions is paramount. A vibration detection device has been deployed at Intel. It is a vibration sensor, digital signal storage, and battery mounted on a silicon wafer. It collects vibrations comparable to those experienced by production wafers. By running it through the tool on standardized recipes, identifiable and characteristic waveforms are collected. The development work is the analysis, interpretation, and corrective action association of these waveforms.
Keywords :
materials handling; semiconductor device manufacture; sensors; vibration measurement; Intel; digital signal storage; excursions; scrapped wafers; vibration detection device; vibration sensing wafer; vibration sensor; wafer handling; Batteries; Image databases; Manufacturing; Production; Resists; Signal analysis; Signal processing; Software packages; Time domain analysis; Vibration measurement;
Conference_Titel :
Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
978-4-9904138-0-4
DOI :
10.1109/ISSM.2006.4493027
