DocumentCode
3293348
Title
Increased Etch Chamber Productivity through the Reduction of Unscheduled Wet Cleans
Author
Ames, Brent
Author_Institution
Metron Technol. Inc., Austin
fYear
2006
fDate
25-27 Sept. 2006
Firstpage
82
Lastpage
84
Abstract
Unscheduled wet cleans on etch chambers can have a large impact on tool availability. Metron has developed a cleaning technology which eliminates the need to open etch chambers to clean particulates off electrostatic chucks, handling equipment, and transfer chambers. Referred to as the chamber maintenance wafer (CMW), this new tool is able to embed particulates and remove them from the chamber without causing contamination. The cleaning wafer also eliminates backside metal contamination in vacuum systems. This paper will review the typical results of the CMW in high volume production fabs focusing on the impact to chamber availability on etch systems.
Keywords
decontamination; etching; integrated circuit manufacture; production equipment; productivity; Metron; chamber maintenance wafer; cleaning technology; contamination; electrostatic chucks; etch chamber productivity; tool availability; unscheduled wet cleans; vacuum systems; Cleaning; Contamination; Costs; Electrostatics; Geometry; Polymer films; Productivity; Semiconductor device manufacture; Silicon; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
Conference_Location
Tokyo
ISSN
1523-553X
Print_ISBN
978-4-9904138-0-4
Type
conf
DOI
10.1109/ISSM.2006.4493028
Filename
4493028
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