• DocumentCode
    3293348
  • Title

    Increased Etch Chamber Productivity through the Reduction of Unscheduled Wet Cleans

  • Author

    Ames, Brent

  • Author_Institution
    Metron Technol. Inc., Austin
  • fYear
    2006
  • fDate
    25-27 Sept. 2006
  • Firstpage
    82
  • Lastpage
    84
  • Abstract
    Unscheduled wet cleans on etch chambers can have a large impact on tool availability. Metron has developed a cleaning technology which eliminates the need to open etch chambers to clean particulates off electrostatic chucks, handling equipment, and transfer chambers. Referred to as the chamber maintenance wafer (CMW), this new tool is able to embed particulates and remove them from the chamber without causing contamination. The cleaning wafer also eliminates backside metal contamination in vacuum systems. This paper will review the typical results of the CMW in high volume production fabs focusing on the impact to chamber availability on etch systems.
  • Keywords
    decontamination; etching; integrated circuit manufacture; production equipment; productivity; Metron; chamber maintenance wafer; cleaning technology; contamination; electrostatic chucks; etch chamber productivity; tool availability; unscheduled wet cleans; vacuum systems; Cleaning; Contamination; Costs; Electrostatics; Geometry; Polymer films; Productivity; Semiconductor device manufacture; Silicon; Wet etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
  • Conference_Location
    Tokyo
  • ISSN
    1523-553X
  • Print_ISBN
    978-4-9904138-0-4
  • Type

    conf

  • DOI
    10.1109/ISSM.2006.4493028
  • Filename
    4493028