Development on the Highly Precise Detection System for the Abnormal Discharge at the Plasma Etching Equipment

Author

Ise, H. ; Shinohara, K. ; Hanawa, T.

Author_Institution

Renesas Technol. Corp., Hitachinaka

fYear

2006

fDate

25-27 Sept. 2006

Firstpage

103

Lastpage

105

Abstract

We´ve established a novel technology that can detect abnormal discharge of dry etching process. This technology consists of a system monitoring the signal of the plasma impedance as well as the reflection power at every 1 msec. (a millisecond) and well-optimized diagnosis algorithm. Based on the algorithm, the system can detect the abnormal discharge even at unstable plasma ignition step and send alarm signal to the dry etcher for stopping the following wafer processing. The detection system based on this technology enables us to minimize the number of damaged wafers due to the abnormal discharging.

Keywords

discharges (electric); plasma diagnostics; plasma heating; semiconductor device manufacture; sputter etching; abnormal discharge detection; alarm signal; high-precise detection system; plasma dry etching equipment; plasma ignition step; plasma impedance; wafer processing; Acoustic signal detection; Dry etching; Electrodes; Ignition; Optical reflection; Plasma applications; Plasma diagnostics; Plasma materials processing; Radio frequency; Signal processing;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on

Conference_Location

Tokyo

ISSN

1523-553X

Print_ISBN

978-4-9904138-0-4

Type

conf

DOI

10.1109/ISSM.2006.4493034

Filename

4493034