DocumentCode
3293514
Title
Study on the chip-level thermal non-uniformity evaluation of semiconductor devices
Author
Guangchen, Zhang ; Shiwei, Feng ; Yuezong, Zhang ; Rong, Su ; Xuesong, Xie ; Chenning, Ge
Author_Institution
Sch. of Electron. Inf. & Control Eng., Beijing Univ. of Technol., Beijing, China
fYear
2009
fDate
6-10 July 2009
Firstpage
541
Lastpage
544
Abstract
A novel method is proposed to evaluate the chip-level thermal non-uniformity of semiconductor devices by electrical transient thermal response testing. It is found that the degree of integrated chip thermal non-uniformity could be determined non-destructively by the device heating response curves.
Keywords
microprocessor chips; semiconductor device packaging; thermal management (packaging); chip-level thermal nonuniformity; device heating response curve; electrical transient thermal response testing; semiconductor devices; Heating; Infrared imaging; Semiconductor devices; Temperature distribution; Temperature sensors; Testing; Thermal conductivity; Thermal engineering; Thermal resistance; Transient analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location
Suzhou, Jiangsu
ISSN
1946-1542
Print_ISBN
978-1-4244-3911-9
Electronic_ISBN
1946-1542
Type
conf
DOI
10.1109/IPFA.2009.5232587
Filename
5232587
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