DocumentCode :
3293515
Title :
Selected-area deposition of diamond films on SiN/Si surfaces with microwave plasma enhanced CVD
Author :
Chen, Yung-Hsin ; Hu, Chen-Ti ; Lin, I-Nan
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear :
1996
fDate :
7-12 Jul 1996
Firstpage :
431
Lastpage :
435
Abstract :
Selected-area deposition (SAD) of diamond films with selectivity greater than 200 was achieved on patterned SiN/Si surface, using microwave plasma CVD method. Among the important parameters that can modify the plasma characteristics, the total pressure and CH4-to-H2 ratio were observed to influence the selected-area deposition behaviors most significantly. The number density of diamonds grown on Si surface decreased rapidly as the total pressure reduced from 75 torr to 60 torr. The selectivity of SAD diamond films increased as the CH4-to-H2 ratio increased from 9:300 sccm to 15:300 sccm. These phenomena were accounted for by the decrease in proportion of ion species with CH4-to-H2 ratio such that the formation of sp3 bonds on Si surfaces is suppressed. Scanning electron microscopy (SEM) and Raman spectroscopy indicated that the quality of diamonds grown on SiN surface was optimized for the SAD films deposited under 2500 W microwave power with CH4-to-H2 = 15:300 sccm
Keywords :
Raman spectra; diamond; elemental semiconductors; plasma CVD; plasma CVD coatings; scanning electron microscopy; semiconductor growth; semiconductor thin films; silicon; silicon compounds; substrates; 2500 W; 60 to 75 torr; C-Si; C-SiN; CH4-to-H2 ratio; Raman spectroscopy; SEM; Si; Si surface; SiN; SiN surface; diamond films; ion species; microwave PECVD; patterned surfaces; plasma characteristics; plasma enhanced CVD; scanning electron microscopy; selected-area deposition; sp3 bond formation suppression; total pressure; Dry etching; Materials science and technology; Microwave theory and techniques; Plasma applications; Plasma materials processing; Plasma properties; Scanning electron microscopy; Semiconductor films; Silicon compounds; Wet etching;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Vacuum Microelectronics Conference, 1996. IVMC'96., 9th International
Conference_Location :
St. Petersburg
Print_ISBN :
0-7803-3594-5
Type :
conf
DOI :
10.1109/IVMC.1996.601858
Filename :
601858
Link To Document :
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