DocumentCode
3293527
Title
A study of combining FIB circuit edit and OBIRCH technology for failure analysis
Author
Yan, JingLin ; Xuesen Liu ; Liu, Mike ; YiLing Liu
Author_Institution
Shanghai FALAB Test Technol. Co., Ltd., Suzhou, China
fYear
2009
fDate
6-10 July 2009
Firstpage
545
Lastpage
548
Abstract
This paper discusses combining focused ion beam (FIB) circuit edit with OBIRH technology. FIB can cut or rewire an integrated circuit. OBIRCH can locate failure location. If FIB circuit edit & OBIRCH were applied at the same time, we can locate the failure site and find the root cause of the failure. The paper share one case of failure analysis and present advanced FIB technology.
Keywords
failure analysis; focused ion beam technology; integrated circuit reliability; IC failure analysis; OBIRH technology; focused ion beam circuit edit; Circuits; Failure analysis; Heating; Infrared imaging; Semiconductor devices; Temperature distribution; Temperature sensors; Testing; Thermal engineering; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location
Suzhou, Jiangsu
ISSN
1946-1542
Print_ISBN
978-1-4244-3911-9
Electronic_ISBN
1946-1542
Type
conf
DOI
10.1109/IPFA.2009.5232588
Filename
5232588
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