DocumentCode
3293528
Title
Electroosmosis Performance Analysis of Microchip Electrophoresis Fabricated by the Ultra-precision CNC Milling
Author
Li, Tian ; Wei, Wang ; Xiaowei, Liu
Author_Institution
MEMS Center, Harbin Inst. of Technol., Harbin, China
fYear
2012
fDate
July 31 2012-Aug. 2 2012
Firstpage
380
Lastpage
383
Abstract
Ultra precision CNC milling can be used to fabricate the Microchip electrophoresis on the substrate of PMMA which exhibited a better electro-osmosis performance. All micro-channels on the chip are 150μm X 140μm in section area, and the separation micro-channel is 5 cm long. The top chip and the bottom one are packaged with hot embossing technique with the ponder pressing machine at the condition of 80°C 0Pa, 5min. EOF performance is theoretical studied based on the theory of low Reynolds Number, electro-osmotic mobility could be calculated μ∞ =2.3 × 10-4 cm2/Vs. While the experiment test EOF with current monitoring method show that the apparent electro-osmosis mobility is μ∞ = 3.02 × 10-4 cm2/Vs at pH9.18, 5mmol/L borax buffer solution. The difference between the theory calculation and experiment results could be explained by the XPS test which indicate that the surface valent bonds intensity were strengthened after milling fabrication.
Keywords
X-ray photoelectron spectra; computerised numerical control; electrohydrodynamics; electrophoresis; embossing; hot pressing; hot working; microchannel flow; microfabrication; milling; osmosis; packaging; precision engineering; presses; process monitoring; PMMA substrate; Reynolds Number; XPS test; borax buffer solution; electroosmosis performance analysis; electroosmotic mobility; hot embossing technique; microchip electrophoresis; milling fabrication; monitoring method; packaging; ponder pressing machine; pressure 0 Pa; separation microchannel; size 140 mum; size 150 mum; surface valent bond intensity; temperature 80 degC; time 5 min; ultraprecision CNC milling; Computer numerical control; Electric fields; Mathematical model; Microchannel; Milling; Substrates; Surface treatment; Microchip Electrophoresis (MCE); Computer Numerical Control (CNC) Milling; Electro-osmosis Flow(EOF); Current Monitor Method;
fLanguage
English
Publisher
ieee
Conference_Titel
Digital Manufacturing and Automation (ICDMA), 2012 Third International Conference on
Conference_Location
GuiLin
Print_ISBN
978-1-4673-2217-1
Type
conf
DOI
10.1109/ICDMA.2012.255
Filename
6298332
Link To Document