• DocumentCode
    3293692
  • Title

    Capacitance-voltage test using an SEM nanoprober

  • Author

    Inoue, Kanzan ; Stallcup, Richard E. ; Sanders, John R. ; Cavanah, Taylor ; Chng, L.C.

  • Author_Institution
    Zyvex Instrum. L.L.C., Richardson, TX, USA
  • fYear
    2009
  • fDate
    6-10 July 2009
  • Firstpage
    523
  • Lastpage
    526
  • Abstract
    The move from one technology node to the next, with the associated transistor geometries shrink, has significantly increased the occurrence of SRAM bit cell errors. Advanced failure analysis labs have employed scanning electron microscope (SEM) based probing systems to isolate individual failed transistors using the Vt curves and Id-Vd family of curves. However, the bit cell errors caused by interface trapped charges and doping related issues may not be thoroughly analyzed using these standard probing electrical tests. Hence, capacitance-voltage (C-V) measurements that are capable of studying oxide layers, interface traps, and charge carrier densities, are considered an appropriate tool to evaluate these conditions. In this communication, we demonstrate C-V testing on gate oxide of individual transistors from the SRAM of an IntelTM 45 nm microprocessor using a Zyvex nanoprobing system and Keithley 4200 parametric analyzer fitted with the C-V option.
  • Keywords
    SRAM chips; cache storage; capacitance measurement; reliability; scanning electron microscopes; transistors; voltage measurement; Keithley 4200 parametric analyzer; SEM nanoprober; SRAM bit cell errors; Zyvex nanoprobing system; advanced failure analysis labs; associated transistor geometries shrink; capacitance-voltage test; charge carrier densities; interface trapped charges; interface traps; oxide layers; probing systems; scanning electron microscope; Capacitance-voltage characteristics; Doping; Electron traps; Failure analysis; Geometry; Isolation technology; Random access memory; Scanning electron microscopy; Testing; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
  • Conference_Location
    Suzhou, Jiangsu
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4244-3911-9
  • Electronic_ISBN
    1946-1542
  • Type

    conf

  • DOI
    10.1109/IPFA.2009.5232594
  • Filename
    5232594