DocumentCode
3293844
Title
Application of quality engineering in semiconductor wafer process
Author
Murashima, Shigenobu
Author_Institution
NEC Kansai Ltd., Shiga
fYear
2006
fDate
25-27 Sept. 2006
Firstpage
201
Lastpage
204
Abstract
We have been applying Taguchi Methods to important processes of semiconductor wafer. We review a couple of cases and then show how these methods can help us improve the key processes efficiently.
Keywords
Taguchi methods; semiconductor device manufacture; wafer level packaging; Taguchi Methods; quality engineering application; semiconductor wafer process; Costs; Data analysis; Etching; Inspection; Mass production; National electric code; Problem-solving; Resistors; Signal processing; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
Conference_Location
Tokyo
ISSN
1523-553X
Print_ISBN
978-4-9904138-0-4
Type
conf
DOI
10.1109/ISSM.2006.4493061
Filename
4493061
Link To Document