Future Trend in Packaging Technology with View from the History

Author

Otsuka, Kanji

Author_Institution

Meisei Univ., Tokyo

fYear

2006

fDate

25-27 Sept. 2006

Firstpage

207

Lastpage

210

Abstract

The historical turning point in packaging technology is introduced. The following conclusions are drawn: (1) A big new market asks for a system with high reliability (2) The flexible interconnection method is searched for from stress the result of (1). Wire bonding is still a solution. (3) As long as the classification of the territory of trade subdivides, structure goes in the direction holding the design-flexibility in a territory. (4) High-speed signal transmission between blocks becomes important with the higher density of a system, and decentralization. Improvement in the speed of signal transmission with the conventional technology can respond enough (Description omitted but presentation will be mentioned). (5) An electric power supply poses a problem most by the advanced system. For this reason, SiP structure comes to attract attention.

Keywords

electronics packaging; integrated circuit reliability; multichip modules; system-in-package; system-on-chip; MCM; SOC; SiP; electronic packaging; flexible interconnections; Calculators; Costs; History; Large scale integration; Microprocessors; Process design; Random access memory; Semiconductor device packaging; Standards development; Turning;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on

Conference_Location

Tokyo

ISSN

1523-553X

Print_ISBN

978-4-9904138-0-4

Type

conf

DOI

10.1109/ISSM.2006.4493063

Filename

4493063