Future Trend in Packaging Technology with View from the History

The historical turning point in packaging technology is introduced. The following conclusions are drawn: (1) A big new market asks for a system with high reliability (2) The flexible interconnection method is searched for from stress the result of (1). Wire bonding is still a solution. (3) As long as the classification of the territory of trade subdivides, structure goes in the direction holding the design-flexibility in a territory. (4) High-speed signal transmission between blocks becomes important with the higher density of a system, and decentralization. Improvement in the speed of signal transmission with the conventional technology can respond enough (Description omitted but presentation will be mentioned). (5) An electric power supply poses a problem most by the advanced system. For this reason, SiP structure comes to attract attention.