DocumentCode
3293949
Title
Analysis of degradation of GaN-Based light-emitting diodes
Author
Wang, Lu ; Feng, Shiwei ; Guo, Chunsheng ; Zhang, Guangchen
Author_Institution
Sch. of Electron. Inf. & Control Eng., Beijing Univ. of Technol., Beijing, China
fYear
2009
fDate
6-10 July 2009
Firstpage
472
Lastpage
475
Abstract
This paper analyzes the degradation of the electrical, optical and thermal characteristics of the light-emitting diodes (LEDs). Two types of LEDs which are defined as sample A and sample B are tested. Their electrical, optical and thermal characteristics have been continuously monitored during the test. The results of our analysis demonstrate that ohmic contacts and resistivity of bulk are stable over stress time; the die attach materials of sample B get worse, but the active layer is better than sample A; the depletion region of sample A is getting worse and sample B is stable. The analysis above offers a new method to find which part degrades seriously.
Keywords
electrical resistivity; gallium compounds; light emitting diodes; ohmic contacts; GaN; electrical characteristics; light-emitting diodes; ohmic contacts; optical characteristics; resistivity; thermal characteristics; CMOS technology; Condition monitoring; Degradation; Hydrogen; Light emitting diodes; MOSFET circuits; Niobium compounds; Semiconductor device measurement; Stress; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location
Suzhou, Jiangsu
ISSN
1946-1542
Print_ISBN
978-1-4244-3911-9
Electronic_ISBN
1946-1542
Type
conf
DOI
10.1109/IPFA.2009.5232606
Filename
5232606
Link To Document