Title :
Investigation of engineering fallout caused by package design marginality
Author :
Goh, L.L. ; Liew, C.N.
Author_Institution :
Altera Corp. (M) Sdn Bhd, Bayan Lepas, Malaysia
Abstract :
This paper had highlighted the packaging design marginality that causing high yield loss in engineering lot. By employing the logic of failure analysis, coupled with a series of conventional sample preparation and inspection methodologies, the effort lead to a full understanding of the failure mechanism that salvaged batches of materials from being assembled.
Keywords :
failure analysis; packaging; reliability; engineering fallout; failure analysis; package design marginality; sample inspection; sample preparation; Assembly; Circuit testing; Design engineering; Electrical equipment industry; Failure analysis; Inspection; Integrated circuit packaging; Manufacturing industries; System testing; Wire;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2009.5232627
