DocumentCode
3294440
Title
Wet etch recipe development for removing lead-free C4 bumps
Author
Qibin, Liu ; Xiaole, Zhao ; Weidong, Huang ; Chin, J.M.
Author_Institution
Device Anal. Lab., AMD Suzhou, Suzhou, China
fYear
2009
fDate
6-10 July 2009
Firstpage
360
Lastpage
362
Abstract
To protect the environment, lead-free solder will be introduced in microelectronic products to replace lead solder. Proper lead-free bump removal is very important to the success of subsequent analysis steps. In this paper, a state-of-the-art wet etch recipe has been developed to remove Sn-Ag-Cu bumps. By optimizing the recipe, the resulting process has enabled the authors to identify defects within failing devices through front-side deprocessing.
Keywords
environmental factors; etching; controlled collapse chip connection; front-side deprocessing; lead-free C4 bumps; lead-free bump removal; lead-free solder; microelectronic products; wet etch recipe development; Chemical processes; Environmentally friendly manufacturing techniques; Failure analysis; Lead; Microelectronics; Packaging; Passivation; Polyimides; Protection; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location
Suzhou, Jiangsu
ISSN
1946-1542
Print_ISBN
978-1-4244-3911-9
Electronic_ISBN
1946-1542
Type
conf
DOI
10.1109/IPFA.2009.5232631
Filename
5232631
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