Title :
The Optimization of Chamber Cleaning in the Etching Equipment
Author :
Yajima, Teruo ; Watanabe, Munenori ; Kawabata, Youichirou ; Ohtake, Koji ; Endo, Minoru ; Aoyama, Masaki ; Imaoka, Kazunori
Author_Institution :
Spansion Japan Co., Ltd., Aizuwakamatu
Abstract :
This study is an investigation of the way to reduce the particle count by using optical emission spectroscopy (O.E.S.). From the results of O.E.S. analysis, it is revealed that the chamber cleaning seriously affects the particle count. The result of our experiment shows that the particle count depends both on CF4 gas flow rate and bias power. By changing the cleaning conditions to lower bias power and higher CF4 flow rate, the particle count and defect count are decreased.
Keywords :
etching; CF4 gas flow rate; chamber cleaning; defect count; etching equipment; optical emission spectroscopy; particle count; Cleaning; Electrons; Etching; Fluid flow; Plasma applications; Plasma chemistry; Plasma sources; Silicon; Spectroscopy; Stimulated emission;
Conference_Titel :
Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
978-4-9904138-0-4
DOI :
10.1109/ISSM.2006.4493097
