Title :
VCSEL/MSM detector smart pixel arrays
Author :
Hibbs-Brenner, M.K. ; Liu, Y. ; Morgan, R. ; Lehman, J.
Author_Institution :
Syst. & Res. Center, Honeywell Inc., Minneapolis, MN, USA
Abstract :
A smart pixel module consisting of two-dimensional arrays of electronic logic elements, drive and receive electronics, optical sources, optical detectors, and lenses for conditioning the optical beams, provides the building block for 3D optically interconnected systems. In order to justify the development of a new technology such as smart pixels, one needs to provide a capability significantly beyond that projected for shop scale packages, for instance, which implies optical device array sizes of thousands of devices. In addition, the integration of optoelectronic devices and optical components must be done very cost effectively, which implies monolithic or heterogeneous integration techniques.
Keywords :
integrated circuit packaging; integrated optoelectronics; metal-semiconductor-metal structures; modules; optical interconnections; photodetectors; smart pixels; MSM detector smart pixel arrays; VCSEL smart pixel arrays; electronic logic elements; heterogeneous integration techniques; lenses; monolithic integration techniques; optical beam conditioning; optical detectors; optical device array sizes; optical source; optoelectronic devices; receive electronics; smart pixel module; smart pixels; two-dimensional arrays; Lenses; Logic arrays; Optical arrays; Optical beams; Optical detectors; Optical devices; Optical interconnections; Sensor arrays; Smart pixels; Vertical cavity surface emitting lasers;
Conference_Titel :
Broadband Optical Networks and Technologies: An Emerging Reality/Optical MEMS/Smart Pixels/Organic Optics and Optoelectronics. 1998 IEEE/LEOS Summer Topical Meetings
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-4953-9
DOI :
10.1109/LEOSST.1998.690258