DocumentCode
3294823
Title
Effect of textures on elastic constants of Cu thin films
Author
Chen, L.
Author_Institution
Sch. of Mater. Sci. & Eng., Univ. of Sci. & Technol. Beijing, Beijing, China
fYear
2009
fDate
6-10 July 2009
Firstpage
278
Lastpage
281
Abstract
Due to their influence on the mechanical properties, residual stresses in thin films have become an important topic in materials science. The elastic constants are required to determine the residual stresses using X-ray diffraction method. The elastic constants of Cu thin films with ideal fibre textures were calculated using the Voigt, Reuss and Hill model in the present work. The results show that the elastic constants are strongly dependent on their textures. When textures exist within Cu thin films, the matrix of the elastic constants converted from cubic symmetry to hexagonal symmetry. In order to analyze the effect of the textures on the elastic constants of Cu thin films quantitatively, the relationship between the elastic constants and textures was derived by the orientation distribution function.
Keywords
X-ray diffraction; copper; elastic constants; integrated circuit interconnections; internal stresses; metallic thin films; Cu; X-ray diffraction method; copper thin films; cubic symmetry; elastic constants; hexagonal symmetry; ideal fibre textures; orientation distribution function; residual stresses; Crystallization; Electromigration; Integrated circuit interconnections; Integrated circuit reliability; Materials science and technology; Metallization; Residual stresses; Thin film circuits; Transistors; X-ray diffraction;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location
Suzhou, Jiangsu
ISSN
1946-1542
Print_ISBN
978-1-4244-3911-9
Electronic_ISBN
1946-1542
Type
conf
DOI
10.1109/IPFA.2009.5232652
Filename
5232652
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