Root cause identification of subtle filament shorts in microprocessors using nano-probing

It has been a challenge for failure analysts to isolate non-visible defects due to the limitations of failure analysis (FA) tools and techniques. Sub-nano defects are often difficult to detect, particularly in highly complex integrated circuit devices. This paper emphasizes the growing importance of nano-probing and its capability to detect subtle defects like nano-sized stringer shorts, which previously went undetected. Successful case studies involving the use of nano-probing techniques to help isolate subtle defects (i.e., those that cause device failure) will be discussed.