DocumentCode
3295044
Title
A Novel Method to Realize Soft Defect Localization Techniques without a Synchronization Signal for Failure Analysis
Author
Wu Chunlei ; Zhai, Lianyin ; Motohiko, Masuda ; Liu, Jiangchuan ; Ma, Hui ; Liu, Jiangchuan
Author_Institution
Freescale Semicond. (China) Ltd., Tianjin, China
fYear
2009
fDate
6-10 July 2009
Firstpage
237
Lastpage
240
Abstract
Failure analysis on advanced logic and mixed signal ICs more and more has to deal with so called dasiasoft defectpsila. In this paper, a novel method to realize Soft Defect Localization (SDL) techniques without a synchronization signal for failure analysis is presented. We will present experimental results showing the accuracy of this method in order to help failure analysis to localize defect in short time.
Keywords
failure analysis; integrated circuit reliability; integrated circuit testing; integrated logic circuits; advanced logic; failure analysis; mixed signal IC; soft defect localization techniques; Bridge circuits; Failure analysis; Horses; Laser transitions; Leakage current; Logic; Temperature dependence; Testing; Timing; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location
Suzhou, Jiangsu
ISSN
1946-1542
Print_ISBN
978-1-4244-3911-9
Electronic_ISBN
1946-1542
Type
conf
DOI
10.1109/IPFA.2009.5232662
Filename
5232662
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