Title :
A Novel Method to Realize Soft Defect Localization Techniques without a Synchronization Signal for Failure Analysis
Author :
Wu Chunlei ; Zhai, Lianyin ; Motohiko, Masuda ; Liu, Jiangchuan ; Ma, Hui ; Liu, Jiangchuan
Author_Institution :
Freescale Semicond. (China) Ltd., Tianjin, China
Abstract :
Failure analysis on advanced logic and mixed signal ICs more and more has to deal with so called dasiasoft defectpsila. In this paper, a novel method to realize Soft Defect Localization (SDL) techniques without a synchronization signal for failure analysis is presented. We will present experimental results showing the accuracy of this method in order to help failure analysis to localize defect in short time.
Keywords :
failure analysis; integrated circuit reliability; integrated circuit testing; integrated logic circuits; advanced logic; failure analysis; mixed signal IC; soft defect localization techniques; Bridge circuits; Failure analysis; Horses; Laser transitions; Leakage current; Logic; Temperature dependence; Testing; Timing; Voltage;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2009.5232662
