DocumentCode :
3295082
Title :
Structural Properties of A1N Thin Films Deposited on Si Using 3C-SiC Buffer Layer
Author :
Lee, Tae-Won ; Chung, Gwiy-Sang
Author_Institution :
Univ. of Ulsan, Ulsan
fYear :
2007
fDate :
June 1 2007-July 5 2007
Firstpage :
27
Lastpage :
29
Abstract :
Polycrystalline aluminum nitride thin films were deposited on polycrystalline 3C-SiC buffer layers by pulsed reactive magnetron sputtering system. Structural properties of AlN/3C-SiC thin films were investigated experimentally by means of FE-SEM, X-ray diffraction, and FT-IR. The columnar structure of AlN thin films was observed by FE-SEM. Results of XRD and FT-IR shows that AlN films on SiC layers were highly (002) oriented. It was determined from infrared absorbance spectrum that the residual stress of AlN thin films grown on SiC layers was almost free. The presented results show that AlN thin films on 3C-SiC buffer layer can be used for M/NEMS applications.
Keywords :
Fourier transform spectra; X-ray diffraction; aluminium compounds; buffer layers; infrared spectra; internal stresses; piezoelectric semiconductors; scanning electron microscopy; semiconductor thin films; silicon compounds; sputter deposition; AlN; Fourier transform infrared spectroscopy; Si; SiC; X-ray diffraction; aluminum nitride; buffer layers; polycrystalline thin films; pulsed reactive magnetron sputtering; residual stress; scanning electron microscopy; Aluminum nitride; Buffer layers; Infrared spectra; Residual stresses; Semiconductor thin films; Silicon carbide; Sputtering; Transistors; X-ray diffraction; X-ray scattering; 3C-SiC; AIN; piezoelectric properties;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices and Materials, 2007. EDM '07. 8th Siberian Russian Workshop and Tutorial on
Conference_Location :
Erlagol, Altai
ISSN :
1815-3712
Print_ISBN :
978-5-7782-0752-3
Type :
conf
DOI :
10.1109/SIBEDM.2007.4292897
Filename :
4292897
Link To Document :
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