DocumentCode :
3295130
Title :
High-temperature Conductive-AFM technique for resolution of soft failures
Author :
Huat, Lim Soon ; Wanxin, Sun ; Narang, Vinod ; Chin, J.M.
Author_Institution :
Device Anal. Lab., Adv. Micro Devices Pte Ltd., Singapore, Singapore
fYear :
2009
fDate :
6-10 July 2009
Firstpage :
204
Lastpage :
207
Abstract :
This paper demonstrates the Veeco heating stage for high temperature Conductive-AFM analysis which is very useful for revealing leaky contacts associated with soft failures. CAFM at 80degC is performed on SOI transistors to isolate leaky polysilicon gate contacts. Nanoprobing at high temperature is performed and it shows strong correlation with the high temperature CAFM data. High temperature CAFM helped to isolate higher gate oxide leakage current in the failing transistor in SRAM memory cell.
Keywords :
atomic force microscopy; failure analysis; high-temperature techniques; silicon-on-insulator; SOI transistor; Veeco heating stage; high temperature conductive-AFM analysis; high-temperature conductive-AFM technique; leaky contacts; leaky polysilicon gate contacts; nanoprobing; soft failures; Circuit testing; Failure analysis; Humidity; Packaging; Research and development; Semiconductor device reliability; Sockets; Substrates; Temperature; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
ISSN :
1946-1542
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
Type :
conf
DOI :
10.1109/IPFA.2009.5232667
Filename :
5232667
Link To Document :
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