DocumentCode :
3295177
Title :
Evolutionary Engineering Collaboration for DFM/DFY Solutions between Foundry and EDA Tool Vendor
Author :
Su, Yea-Huey ; Guo, Ruey-Shan ; Chang, Hsiao-Huan
Author_Institution :
Nat. Central Univ., Chungli
fYear :
2006
fDate :
25-27 Sept. 2006
Firstpage :
475
Lastpage :
478
Abstract :
With the migration to deep-submicron technology, foundries face even more challenges than ever to help their customers to develop IC for time-to-market. The goal of this research is then to explore how foundries and EDA tool vendors collaborate with each other for DFM/DFY solutions. By conducting field interviews and empirical study on two leading foundries and three EDA tool vendors, this research summarizes four aspects of collaboration activities, which are design problem, design scope, released information, and collaboration mechanism, under three different collaboration stages. Results of the study show that in the era of DFM, both parties have expanded their collaboration activities, from post-design manufacturing stage to all stages of design. In addition, the collaboration pattern has transformed from input-output coordination to know-how sharing and then to know-how creation in 90nm technology. The study concludes that as design automation and process technology become more advanced, the value of reference flow becomes higher.
Keywords :
design for manufacture; foundries; integrated circuit yield; time to market; collaboration activities; deep-submicron technology; evolutionary engineering collaboration; foundries; input-output coordination; know-how creation; know-how sharing; post-design manufacturing stage; time-to-market; Collaboration; Collaborative tools; Design for manufacture; Electronic design automation and methodology; Foundries; Information management; Lead; Magnetic force microscopy; Manufacturing; Time to market;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
Conference_Location :
Tokyo
ISSN :
1523-553X
Print_ISBN :
978-4-9904138-0-4
Type :
conf
DOI :
10.1109/ISSM.2006.4493140
Filename :
4493140
Link To Document :
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