DocumentCode :
3295507
Title :
Trapping/detrapping characteristics of electrons and holes under dynamic NBTI stress on HfO2 and HfSiON gate dielectrics
Author :
Wei-Liang Lin ; Lou, Jen-Chung ; Lee, Yao-Jen ; Chao, Tien-Sheng
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear :
2009
fDate :
6-10 July 2009
Firstpage :
122
Lastpage :
125
Abstract :
DNBTI on HfO2 and HfSiON has been investigated. The DNBTI model under NBTI/passivated stress cycles has proposed. In addition, as compared with the recovery of the VTH and charge pumping current under passivated stress, the variation of the interface states are not main factor to reduce the magnitude of VTH during the passivated stress cycle.
Keywords :
CMOS integrated circuits; hafnium compounds; high-k dielectric thin films; silicon compounds; HfO2; HfSiON; charge current; dynamic negative bias temperature instability stress; gate dielectrics; passivated stress cycles; trapping-detrapping characteristics; Charge carrier processes; Charge pumps; Electron traps; Hafnium oxide; High K dielectric materials; Niobium compounds; Silicon; Stress; Titanium compounds; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
ISSN :
1946-1542
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
Type :
conf
DOI :
10.1109/IPFA.2009.5232685
Filename :
5232685
Link To Document :
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