DocumentCode :
3295518
Title :
The Case Development of a Heat Flux Sensor
Author :
Lobach, Roman V. ; Lobach, Oleg V. ; Dikareva, Regina P.
Author_Institution :
Novosibirsk State Tech. Univ., Novosibirsk
fYear :
2007
fDate :
June 1 2007-July 5 2007
Firstpage :
113
Lastpage :
114
Abstract :
The thermal phenomena influence course of the majority of physical processes, therefore the control of thermal parameters represents huge practical interest, and rapid development of modern techniques demands from all metrological means, including from thermal measurement devices, more and more high accuracy and reliability. In turn development of such directions as the micromechanics and the micro system technology opens new opportunities before developers of measuring devices. On the basis of semiconductor materials, using the given technologies, it is possible to create the tiny heat flux sensors possessing high sensitivity and the low cost price. On faculty of semiconductor devices and microelectronics the silicon chip of a heat flux sensor has been developed, and also together with the Novosibirsk test set of sensitive elements (chips) has been produced.
Keywords :
integrated circuit measurement; semiconductor device measurement; temperature sensors; Novosibirsk test; heat flux sensor; microelectronics; semiconductor material; silicon chip; Costs; Microelectronics; Process control; Rapid thermal processing; Semiconductor device measurement; Semiconductor devices; Semiconductor materials; Sensor phenomena and characterization; Silicon; Thermal sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices and Materials, 2007. EDM '07. 8th Siberian Russian Workshop and Tutorial on
Conference_Location :
Erlagol, Altai
ISSN :
1815-3712
Print_ISBN :
978-5-7782-0752-3
Type :
conf
DOI :
10.1109/SIBEDM.2007.4292928
Filename :
4292928
Link To Document :
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