• DocumentCode
    3295518
  • Title

    The Case Development of a Heat Flux Sensor

  • Author

    Lobach, Roman V. ; Lobach, Oleg V. ; Dikareva, Regina P.

  • Author_Institution
    Novosibirsk State Tech. Univ., Novosibirsk
  • fYear
    2007
  • fDate
    June 1 2007-July 5 2007
  • Firstpage
    113
  • Lastpage
    114
  • Abstract
    The thermal phenomena influence course of the majority of physical processes, therefore the control of thermal parameters represents huge practical interest, and rapid development of modern techniques demands from all metrological means, including from thermal measurement devices, more and more high accuracy and reliability. In turn development of such directions as the micromechanics and the micro system technology opens new opportunities before developers of measuring devices. On the basis of semiconductor materials, using the given technologies, it is possible to create the tiny heat flux sensors possessing high sensitivity and the low cost price. On faculty of semiconductor devices and microelectronics the silicon chip of a heat flux sensor has been developed, and also together with the Novosibirsk test set of sensitive elements (chips) has been produced.
  • Keywords
    integrated circuit measurement; semiconductor device measurement; temperature sensors; Novosibirsk test; heat flux sensor; microelectronics; semiconductor material; silicon chip; Costs; Microelectronics; Process control; Rapid thermal processing; Semiconductor device measurement; Semiconductor devices; Semiconductor materials; Sensor phenomena and characterization; Silicon; Thermal sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Materials, 2007. EDM '07. 8th Siberian Russian Workshop and Tutorial on
  • Conference_Location
    Erlagol, Altai
  • ISSN
    1815-3712
  • Print_ISBN
    978-5-7782-0752-3
  • Type

    conf

  • DOI
    10.1109/SIBEDM.2007.4292928
  • Filename
    4292928