• DocumentCode
    3295584
  • Title

    Failure analysis overview and its new challenges

  • Author

    Li, Susan X.

  • Author_Institution
    Spansion Inc., Sunnyvale, CA, USA
  • fYear
    2009
  • fDate
    6-10 July 2009
  • Firstpage
    100
  • Lastpage
    107
  • Abstract
    Failure analysis is a critical step for solving design, process, product and customer application issues. Failure analysts need to have strong and broad technical background as well as unique personality to be successful in this field. Failure analysis flow contains 8 basic steps, and should be followed to ensure the quality of the daily analysis work. Three case studies were demonstrated on how to use the 8-step FA flow to solve real life problems. With new technology, device materials and architecture in advanced products, new challenges need to be met in order to successfully support the failure analysis needs in the coming years.
  • Keywords
    failure analysis; integrated circuit reliability; 8-step FA flow; failure analysis; semiconductor company; Failure analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
  • Conference_Location
    Suzhou, Jiangsu
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4244-3911-9
  • Electronic_ISBN
    1946-1542
  • Type

    conf

  • DOI
    10.1109/IPFA.2009.5232690
  • Filename
    5232690