DocumentCode
3295584
Title
Failure analysis overview and its new challenges
Author
Li, Susan X.
Author_Institution
Spansion Inc., Sunnyvale, CA, USA
fYear
2009
fDate
6-10 July 2009
Firstpage
100
Lastpage
107
Abstract
Failure analysis is a critical step for solving design, process, product and customer application issues. Failure analysts need to have strong and broad technical background as well as unique personality to be successful in this field. Failure analysis flow contains 8 basic steps, and should be followed to ensure the quality of the daily analysis work. Three case studies were demonstrated on how to use the 8-step FA flow to solve real life problems. With new technology, device materials and architecture in advanced products, new challenges need to be met in order to successfully support the failure analysis needs in the coming years.
Keywords
failure analysis; integrated circuit reliability; 8-step FA flow; failure analysis; semiconductor company; Failure analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location
Suzhou, Jiangsu
ISSN
1946-1542
Print_ISBN
978-1-4244-3911-9
Electronic_ISBN
1946-1542
Type
conf
DOI
10.1109/IPFA.2009.5232690
Filename
5232690
Link To Document