Analysis of propagation delay in mixed carbon nanotube bundle as global VLSI interconnects

Author

Das, Pradip K. ; Majumder, Manoj Kumar ; Kaushik, B.K. ; Dasgupta, S.

Author_Institution

Dept. of Electron. & Comput. Eng., Indian Inst. of Technol. Roorkee, Roorkee, India

fYear

2012

fDate

5-7 Dec. 2012

Firstpage

118

Lastpage

121

Abstract

This research paper introduces a new modeling approach for different bundled CNT structures. Based on the arrangements of single- and multi-walled CNTs in bundle, two different structures of mixed CNT bundles (MCBs) are proposed. Performance in terms of propagation delay is compared between different bundled CNT structures by using a driver-interconnect-load (DIL) system. It has been observed that the overall reduction in delay is in the range of 22.33% to 56.87% for bundled MWCNT with respect to other CNT structures at global interconnect lengths.

Keywords

VLSI; carbon nanotubes; integrated circuit interconnections; DIL system; MCB; MWCNT; driver-interconnect-load system; global VLSI interconnects; global interconnect lengths; mixed carbon nanotube bundle; multiwalled CNT; propagation delay analysis; single-walled CNT; Carbon nanotubes; Delay; Geometry; Graphene; Integrated circuit interconnections; Microelectronics; Propagation delay; Carbon nanotube (CNT); VLSI; equivalent single conductor (ESC); interconnect; mixed CNT bundle (MCB); propagation delay;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics and Electronics (PrimeAsia), 2012 Asia Pacific Conference on Postgraduate Research in

Conference_Location

Hyderabad

ISSN

2159-2144

Print_ISBN

978-1-4673-5065-5

Type

conf

DOI

10.1109/PrimeAsia.2012.6458638

Filename

6458638