Title :
Analysis of propagation delay in mixed carbon nanotube bundle as global VLSI interconnects
Author :
Das, Pradip K. ; Majumder, Manoj Kumar ; Kaushik, B.K. ; Dasgupta, S.
Author_Institution :
Dept. of Electron. & Comput. Eng., Indian Inst. of Technol. Roorkee, Roorkee, India
Abstract :
This research paper introduces a new modeling approach for different bundled CNT structures. Based on the arrangements of single- and multi-walled CNTs in bundle, two different structures of mixed CNT bundles (MCBs) are proposed. Performance in terms of propagation delay is compared between different bundled CNT structures by using a driver-interconnect-load (DIL) system. It has been observed that the overall reduction in delay is in the range of 22.33% to 56.87% for bundled MWCNT with respect to other CNT structures at global interconnect lengths.
Keywords :
VLSI; carbon nanotubes; integrated circuit interconnections; DIL system; MCB; MWCNT; driver-interconnect-load system; global VLSI interconnects; global interconnect lengths; mixed carbon nanotube bundle; multiwalled CNT; propagation delay analysis; single-walled CNT; Carbon nanotubes; Delay; Geometry; Graphene; Integrated circuit interconnections; Microelectronics; Propagation delay; Carbon nanotube (CNT); VLSI; equivalent single conductor (ESC); interconnect; mixed CNT bundle (MCB); propagation delay;
Conference_Titel :
Microelectronics and Electronics (PrimeAsia), 2012 Asia Pacific Conference on Postgraduate Research in
Conference_Location :
Hyderabad
Print_ISBN :
978-1-4673-5065-5
DOI :
10.1109/PrimeAsia.2012.6458638
