Title :
An advanced reliability improvement and failure analysis approach to thermal stress issues in IC packages
Author :
Hertl, Michael ; Weidmann, Diane ; Ngai, Alex
Author_Institution :
Insidix, Grenoble, France
Abstract :
A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.
Keywords :
delamination; failure analysis; integrated circuit packaging; integrated circuit reliability; risk management; thermal stresses; BGA; IC Packages; JEDEC type reflow cycles; advanced reliability improvement; bad solderability assessment; delamination risk; failure analysis; thermal stress; topography and deformation measurement; Assembly; Cooling; Delamination; Failure analysis; Heating; Integrated circuit packaging; Manufacturing; Surfaces; Temperature; Thermal stresses;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2009.5232706
