Title :
Resolution and sensitivity enhancements of scanning optical microscopy techniques for integrated circuit failure analysis
Author :
Phang, Jacob H. ; Goh, S.H. ; Quah, A.C.T. ; Chua, C.M. ; Koh, L.S. ; Tan, S.H. ; Chua, W.P.
Author_Institution :
Centre for Integrated Circuit Failure Anal. & Reliability (CICFAR), Nat. Univ. of Singapore, Singapore, Singapore
Abstract :
Scanning optical microscopy techniques are effective for optical fault localization of failures that are sensitive to thermal stimulation. In this paper, the recent developments in resolution and sensitivity enhancements that allow these techniques to be used with advanced technology nodes are described. The enhancement methods include refractive solid immersion lens technology, dc-coupling of the laser induced detection system and laser pulsing with signal integration algorithm. The combination of these enhanced scanning optical microscopy techniques and refractive solid immersion lens technology has brought about significantly better localization precision and sensitivity.
Keywords :
failure analysis; monolithic integrated circuits; optical microscopy; sensitivity; dc-coupling; integrated circuit failure analysis; laser induced detection system; laser pulsing; lens technology; optical fault localization; refractive solid immersion; refractive solid immersion lens technology; scanning optical microscopy techniques; sensitivity enhancements; signal integration algorithm; thermal stimulation; Circuit faults; Failure analysis; Integrated optics; Lenses; Optical microscopy; Optical refraction; Optical sensors; Photonic integrated circuits; Solid lasers; Stimulated emission;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2009.5232707