DocumentCode
3295869
Title
In-situ polyimide removal using modified dual acid decapsulator
Author
Ramachandra, C. ; Dash, Sarat Kumar ; Ravindra, M. ; Khan, Adnan M. ; Sweety, B.M. ; Chandan, U.G. ; Jaypal, D.
Author_Institution
Siddaganga Inst. of Technol., Tumkur, India
fYear
2010
fDate
5-9 July 2010
Firstpage
1
Lastpage
3
Abstract
Removal of polyimide layer after decapsulation of IC package is essential for many of the failure analysis techniques. An alternative method for polyimide removal is described in this paper. The method suggests appropriate modification of dual acid decapsulation system for this purpose. Device integrity is verified after removal of polyimide layer. This method becomes promising for devices which are sensitive/vulnerable for exposure to plasma.
Keywords
failure analysis; integrated circuit packaging; IC package decapsulation; device integrity; failure analysis techniques; in-situ polyimide removal; modified dual acid decapsulator; Chemicals; Failure analysis; Integrated circuit packaging; Passivation; Plasma applications; Plasma devices; Plasma temperature; Plastic integrated circuit packaging; Polyimides; Valves;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2010 17th IEEE International Symposium on the
Conference_Location
Singapore
ISSN
1946-1542
Print_ISBN
978-1-4244-5596-6
Type
conf
DOI
10.1109/IPFA.2010.5531986
Filename
5531986
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