DocumentCode
3295973
Title
Combining High Resolution Pulsed TIVA and nanoprobing techniques to identify drive strength issues in mixed signal circuits
Author
Ravikumar, V.K. ; Ho, M.Y. ; Goruganthu, R.R. ; Phoa, S.L. ; Narang, V. ; Chin, J.M.
Author_Institution
Adv. Micro Devices Singapore Pte Ltd., Singapore, Singapore
fYear
2010
fDate
5-9 July 2010
Firstpage
1
Lastpage
4
Abstract
This paper uses an interesting case study to highlight High Resolution Pulsed TIVA with Solid Immersion Lens (SIL) as a technique to isolate a temperature sensitive failure in a mixed signal circuitry followed by circuit analysis and Nanoprobing to confirm a drive strength issue caused by a process change.
Keywords
fault diagnosis; integrated circuit testing; mixed analogue-digital integrated circuits; nanoelectronics; circuit analysis; device under test; drive strength; high resolution pulsed TIVA; mixed signal circuitry; nanoprobing; process change; solid immersion lens; temperature sensitive failure; thermal induced voltage alteration; Circuit faults; Circuit testing; Failure analysis; Lenses; Pulse circuits; Signal processing; Signal resolution; Solids; Temperature sensors; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2010 17th IEEE International Symposium on the
Conference_Location
Singapore
ISSN
1946-1542
Print_ISBN
978-1-4244-5596-6
Type
conf
DOI
10.1109/IPFA.2010.5531991
Filename
5531991
Link To Document