Title :
Scaling in floating-gate non-volatile memory technologies and its implication on reliability
Author_Institution :
NXP Semicond., Nijmegen, Netherlands
Abstract :
In recent years, flash memory has become the driving force in process technology development. This paper discusses a few reliability related effects associated with the scaling of floating-gate based NVM technologies: A) scaling the active area would cause a wider spread of natural Vt of the cells, this brings new challenges in media management and error correction, especially for multi-level applications. B) cell coupling-ratio will reduce due to increasing influence of parasitic capacitances; the inter-cell coupling effect will increase among the neighboring cells; this can affect the cell Vt window or imposes a higher requirement for on chip high voltage handling. C) In embedded memories, a very limited additional thermal budget is allowed on the advanced core logic technology, this brings a new challenge to minimize the thermal budget related to the flash process steps without affecting the flash reliability.
Keywords :
circuit reliability; flash memories; random-access storage; advanced core logic technology; cell coupling-ratio; embedded memories; error correction; flash memory reliability; floating-gate nonvolatile memory technologies; intercell coupling effect; media management; on chip high voltage handling; parasitic capacitance; thermal budget; Character generation; Dielectrics; Electrons; Flash memory; Isolation technology; Nonvolatile memory; Paper technology; Parasitic capacitance; Semiconductor device reliability; Space technology;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2009.5232716