DocumentCode
3296084
Title
Instability of p-channel poly-Si thin-film transistors under dynamic negative bias temperature stress
Author
Zhou, Jie ; Wang, Mingxiang ; Wong, Man
Author_Institution
Dept. of Microelectron., Soochow Univ., Suzhou, China
fYear
2010
fDate
5-9 July 2010
Firstpage
1
Lastpage
4
Abstract
Degradation of p-channel poly-Si thin-film transistors (TFTs) under dynamic negative bias temperature (NBT) stress has been investigated. Two-stage degradation behavior is first observed. In the first stage, significant positive threshold voltage (Vth) shift occurs. The dynamic effect which is associated with pulse falling time (tf) and amplitude may be responsible for the instability. Short tf and high amplitude will introduce more significant dynamic effect. After a long time stress, “turnaround” behavior in the Vth is observed. Equivalent DC negative bias temperature instability is the dominate degradation mechanism.
Keywords
thermal analysis; thermal stability; thin film transistors; amplitude; dynamic negative bias temperature stress; equivalent DC negative bias temperature instability; p-channel poly-Si thin-film transistor; pulse falling time; threshold voltage; turnaround behavior; two-stage degradation behavior; Crystallization; Degradation; Microelectronics; Negative bias temperature instability; Niobium compounds; Stress; Testing; Thin film transistors; Threshold voltage; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2010 17th IEEE International Symposium on the
Conference_Location
Singapore
ISSN
1946-1542
Print_ISBN
978-1-4244-5596-6
Type
conf
DOI
10.1109/IPFA.2010.5531996
Filename
5531996
Link To Document