DocumentCode :
3296318
Title :
Reliability performance of ETOX based flash memories
Author :
Verma, Gautam ; Mielke, Neal
Author_Institution :
Intel Corp., Santa Clara, CA, USA
fYear :
1988
fDate :
12-14 Apr 1988
Firstpage :
158
Lastpage :
166
Abstract :
The reliability performance of a 64 K flash memory based on a single-transistor, floating-gate memory cell is considered. The reliability performance of these memories, before program/erase cycling, matches that of UV EPROMs. Cycling generally does not introduce defect-related failures common to some EEPROMs. However, it may aggravate two intrinsic instabilities found in the UV EPROM (intrinsic charge loss and the DC program disturb mechanism). Experience shows that these are related effects caused by injection of holes during the erase step of the cycle. High source-to-substrate electric fields, during erase, generate these holes. Channel hot electron injection, for programming, plays no significant role in the observed degradation. These cycling effects can be addressed through incorporation of additional margin into the flash cell. Through such cell optimization, the reliability of these memories is made equivalent to that of conventional UV EPROMs, even after hundreds of program/erase cycles
Keywords :
PROM; circuit reliability; integrated memory circuits; 64 kbit; DC program disturb mechanism; ETOX based flash memories; UV EPROMs; cell optimization; defect-related failures; floating-gate memory cell; hole injection; intrinsic charge loss; intrinsic instabilities; program/erase cycling; reliability performance; Channel hot electron injection; Degradation; Dielectric substrates; EPROM; Flash memory; Flash memory cells; Manufacturing; Nonvolatile memory; Packaging; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium 1988. 26th Annual Proceedings., International
Conference_Location :
Monterey, CA
Type :
conf
DOI :
10.1109/RELPHY.1988.23444
Filename :
23444
Link To Document :
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