DocumentCode :
3296339
Title :
Statistical Variations of Interconnect Parasitics: Extraction and Circuit Simulation
Author :
Kinzelbach, Harald
Author_Institution :
Infineon Technol., Munich
fYear :
2006
fDate :
9-12 May 2006
Firstpage :
33
Lastpage :
36
Abstract :
With an increasing influence of parasitic interconnect properties on the circuit performance, one also sees an increasing necessity to appropriately model the corresponding fluctuations induced by unavoidable random process variations, and to include them in subsequent circuit simulations. The paper discusses an efficient approach that addresses this problem using a semi-analytic approximation. It is based on an appropriate linearization scheme which allows one to systematically analyze the fluctuations of the parasitic capacitance and resistance values of given layout configurations. After a short sketch of the basic approach, we first discuss how the method is used to systematically analyze random variations of interconnect properties of simple representative two-dimensional interconnect models for long bus line configurations. In the second part of the paper we then sketch a 3D flow implementation for a full interconnect-parasitics variation-extraction for real industrial layouts
Keywords :
circuit layout; circuit simulation; linearisation techniques; random processes; statistical analysis; 3D flow implementation; bus line configurations; industrial layouts; interconnect parasitics; linearization scheme; parasitic capacitance; resistance values; statistical variations; subsequent circuit simulations; two-dimensional interconnect models; unavoidable random process variations; Appropriate technology; Circuit optimization; Circuit simulation; Dielectrics; Fluctuations; Geometry; Integrated circuit interconnections; Metals industry; Parasitic capacitance; Random processes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signal Propagation on Interconnects, 2006. IEEE Workshop on
Conference_Location :
Berlin, Germany
Print_ISBN :
1-4244-0455-x
Electronic_ISBN :
1-4244-0455-x
Type :
conf
DOI :
10.1109/SPI.2006.289180
Filename :
4069395
Link To Document :
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