DocumentCode :
3296388
Title :
The Impact of Leakage to the Power Supply Impedance of a Microprocessor
Author :
Sarangi, Ananda ; Taylor, Greg
Author_Institution :
Intel Corp., Hillsboro, OR
fYear :
2006
fDate :
9-12 May 2006
Firstpage :
43
Lastpage :
46
Abstract :
This paper shows that the resonant behavior of a microprocessor´s power supply is strongly influenced by both the leakage and the dynamic power of the microprocessor. As a result of this, the peak package power supply impedance is a function of the operating conditions of the microprocessor. Measurements on a 65 nm Intelreg Pentiumreg 4 microprocessor have been used to quantify this behavior
Keywords :
electronics packaging; microprocessor chips; power supplies to apparatus; leakage impact; microprocessor; peak package power supply impedance; Capacitance; Capacitors; Damping; Frequency; Impedance; Microprocessors; Packaging; Power supplies; Resonance; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signal Propagation on Interconnects, 2006. IEEE Workshop on
Conference_Location :
Berlin, Germany
Print_ISBN :
1-4244-0455-x
Electronic_ISBN :
1-4244-0455-x
Type :
conf
DOI :
10.1109/SPI.2006.289184
Filename :
4069399
Link To Document :
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