DocumentCode
3296495
Title
[Front matter]
fYear
2009
fDate
6-10 July 2009
Abstract
The following topics are dealt with: photovoltaic and solar modules; electronics packaging; power electronics; MOSFETs; semiconductor device metallisation and interconnections; semiconductor device reliability; thin film transistors; HBTs; and MEMS.
Keywords
MOSFET; electronics packaging; heterojunction bipolar transistors; interconnections; metallisation; power electronics; semiconductor device reliability; solar cells; thin film transistors; HBT; MEMS; MOSFET; electronics packaging; photovoltaic module; power electronics; semiconductor device interconnection; semiconductor device metallisation; semiconductor device reliability; solar module; thin film transistor;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location
Suzhou, Jiangsu
ISSN
1946-1542
Print_ISBN
978-1-4244-3911-9
Type
conf
DOI
10.1109/IPFA.2009.5232739
Filename
5232739
Link To Document