DocumentCode :
3296503
Title :
Fatigue of soft-soldered contacts at surface-mounted devices
Author :
Hieber, Hartmann
Author_Institution :
Philips GmbH Forschungslab., Hamburg, West Germany
fYear :
1988
fDate :
12-14 Apr 1988
Firstpage :
234
Lastpage :
238
Abstract :
An attempt is made to show the partially reversible flow mechanics of soft-soldered contacts. It is pointed out that the localization of irreversible strain makes a prediction of failure during thermomechanical fatigue tests difficult. Viscoelastic flow of SnPb40 solder is discussed, along with the microstructure of soft-soldered contacts
Keywords :
failure analysis; fatigue testing; lead alloys; soldering; surface mount technology; thermal stress cracking; tin alloys; viscoelasticity; SnPb40 solder; failure prediction; irreversible strain localisation; microstructure; partially reversible flow mechanics; soft-soldered contacts; surface-mounted devices; thermomechanical fatigue tests; viscoelastic flow; Capacitive sensors; Creep; Elasticity; Fatigue; Microstructure; Plastics; Strain measurement; Temperature; Tensile stress; Testing; Thermal stresses; Thermomechanical processes; Viscosity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium 1988. 26th Annual Proceedings., International
Conference_Location :
Monterey, CA
Type :
conf
DOI :
10.1109/RELPHY.1988.23456
Filename :
23456
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3296503
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